CVE-2017-18073 Information disclosure in Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear

High 7.5 Published Updated

Attackers can access unauthorized memory in Qualcomm Snapdragon chipsets, potentially exposing sensitive data.

Exploited in the wild
Not known
Login needed
Not needed
Attackable
Over the internet
Victim action needed
Not needed
Fix
None listed

What is CVE-2017-18073?

CVE-2017-18073 is a high-severity vulnerability in Qualcomm Mdm9206 Firmware, published on 11 Apr 2018. An attacker can exploit it over the internet without logging in, with no action from the victim.

Official description

In Android before security patch level 2018-04-05 on Qualcomm Snapdragon Automobile, Snapdragon Mobile, and Snapdragon Wear MDM9206, MDM9607, MDM9650, SD 210/SD 212/SD 205, SD 820, SD 820A, SD 835, the HLOS can gain access to unauthorized memory.

Weakness: CWE-668

Which versions are affected by CVE-2017-18073?

It affects 9 products.

Products include Qualcomm Mdm9206 Firmware, Qualcomm Mdm9607 Firmware, Qualcomm Mdm9650 Firmware, Qualcomm Sd 205 Firmware, Qualcomm Sd 210 Firmware, Qualcomm Sd 212 Firmware and 3 more.

How do I fix CVE-2017-18073?

No fix has been published for CVE-2017-18073 yet. Limit exposure of the affected software until one is available.

Is CVE-2017-18073 being exploited?

There is no known exploitation of CVE-2017-18073 in the wild and no public exploit code.

All Qualcomm Mdm9206 Firmware vulnerabilities

Sources

Also known as GHSA-3h2x-cpjg-qq3m.

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