CVE-2017-18157 Use after free in Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear

High 7.8 Published Updated

A use-after-free flaw in the Thermal Engine allows attackers to execute arbitrary code or escalate privileges on affected Qualcomm Snapdragon devices.

Exploited in the wild
Not known
Login needed
Any signed-in user
Attackable
Local or same network only
Victim action needed
Not needed
Fix
None listed

What is CVE-2017-18157?

CVE-2017-18157 is a high-severity use after free vulnerability in Qualcomm Mdm9206 Firmware, published on 6 May 2019. It can only be exploited from the same machine or local network, with no action from the victim.

Official description

A Use After Free Condition can occur in Thermal Engine in Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear in MDM9206, MDM9607, MDM9650, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 425, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 820, SD 820A, SD 835, SD 845, SDX20.

Weakness: CWE-416

Which versions are affected by CVE-2017-18157?

It affects 21 products.

Products include Qualcomm Mdm9206 Firmware, Qualcomm Mdm9607 Firmware, Qualcomm Mdm9650 Firmware, Qualcomm Msm8909w Firmware, Qualcomm Msm8996au Firmware, Qualcomm Sd 205 Firmware and 15 more.

How do I fix CVE-2017-18157?

No fix has been published for CVE-2017-18157 yet. Limit exposure of the affected software until one is available.

Upgrade to the fixed version. These bugs are found with fuzzing and sanitisers and avoided by memory-safe languages. More about Use after free.

Is CVE-2017-18157 being exploited?

There is no known exploitation of CVE-2017-18157 in the wild and no public exploit code.

All Qualcomm Mdm9206 Firmware vulnerabilities

Sources

Also known as GHSA-78g8-m8gm-cxh7.

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