CVE-2017-18303 Memory corruption in Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear

High 7.8 Published Updated

A buffer overflow in Qualcomm Snapdragon firmware allows attackers to execute arbitrary code or escalate privileges via malicious sensor registry inputs.

Exploited in the wild
Not known
Login needed
Any signed-in user
Attackable
Local or same network only
Victim action needed
Not needed
Fix
None listed

What is CVE-2017-18303?

CVE-2017-18303 is a high-severity memory corruption vulnerability in Qualcomm Mdm9206 Firmware, published on 23 Oct 2018. It can only be exploited from the same machine or local network, with no action from the victim.

Official description

While processing the sensors registry configuration file, if inputs are not validated a buffer overflow will occur in Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear in version MMDM9206, MDM9607, MDM9650, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 425, SD 430, SD 450, SD 600, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 800, SD 810, SD 820, SD 820A, SD 835, SDA660, SDX20.

Weakness: CWE-119

Which versions are affected by CVE-2017-18303?

It affects 26 products.

Products include Qualcomm Mdm9206 Firmware, Qualcomm Mdm9607 Firmware, Qualcomm Mdm9650 Firmware, Qualcomm Msm8909w Firmware, Qualcomm Msm8996au Firmware, Qualcomm Sd 205 Firmware and 20 more.

How do I fix CVE-2017-18303?

No fix has been published for CVE-2017-18303 yet. Limit exposure of the affected software until one is available.

Upgrade to the fixed version. Memory-safe languages, compiler hardening and fuzzing prevent most new cases. More about Memory corruption.

Is CVE-2017-18303 being exploited?

There is no known exploitation of CVE-2017-18303 in the wild and no public exploit code.

All Qualcomm Mdm9206 Firmware vulnerabilities

Sources

Also known as GHSA-v2xg-hfh9-px4q.

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