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CVE-2017-18305 Privilege escalation in Snapdragon Mobile, Snapdragon Wear

High 7.0 Published Updated

Attackers can gain complete control of EL3 by unlocking XPUs via a system call if the enable fuse is not blown in specific Snapdragon chipsets.

Exploited in the wild
Not known
Login needed
Any signed-in user
Attackable
Local or same network only
Victim action needed
Not needed
Fix
None listed

What is CVE-2017-18305?

CVE-2017-18305 is a high-severity vulnerability in Qualcomm Mdm9206 Firmware, published on 23 Oct 2018. It can only be exploited from the same machine or local network, with no action from the victim.

Official description

XBL sec mem dump system call allows complete control of EL3 by unlocking all XPUs if enable fuse is not blown in Snapdragon Mobile, Snapdragon Wear in version MDM9206, MDM9607, MDM9650, SD 210/SD 212/SD 205, SD 835.

Which versions are affected by CVE-2017-18305?

It affects 7 products.

Products include Qualcomm Mdm9206 Firmware, Qualcomm Mdm9607 Firmware, Qualcomm Mdm9650 Firmware, Qualcomm Sd 205 Firmware, Qualcomm Sd 210 Firmware, Qualcomm Sd 212 Firmware and 1 more.

How do I fix CVE-2017-18305?

No fix has been published for CVE-2017-18305 yet. Limit exposure of the affected software until one is available.

Is CVE-2017-18305 being exploited?

There is no known exploitation of CVE-2017-18305 in the wild and no public exploit code.

All Qualcomm Mdm9206 Firmware vulnerabilities

Sources

Also known as GHSA-xmf6-f45p-m45j.

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