CVE-2017-18319 Information disclosure in Snapdragon Mobile, Snapdragon Wear

Medium 5.5 Published Updated

An information leak in UIM API debug messages allows attackers to read sensitive data from Qualcomm Snapdragon mobile and wear devices.

Exploited in the wild
Not known
Login needed
Any signed-in user
Attackable
Local or same network only
Victim action needed
Not needed
Fix
None listed

What is CVE-2017-18319?

CVE-2017-18319 is a medium-severity vulnerability in Qualcomm Mdm9206 Firmware, published on 3 Jan 2019. It can only be exploited from the same machine or local network, with no action from the victim.

Official description

Information leak in UIM API debug messages in snapdragon mobile and snapdragon wear in versions MDM9206, MDM9607, MDM9615, MDM9625, MDM9635M, MDM9645, MDM9650, MDM9655, MSM8909W, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 800, SD 810, SD 820, SD 835, Snapdragon_High_Med_2016.

Weakness: CWE-320

Which versions are affected by CVE-2017-18319?

It affects 30 products.

Products include Qualcomm Mdm9206 Firmware, Qualcomm Mdm9607 Firmware, Qualcomm Mdm9615 Firmware, Qualcomm Mdm9625 Firmware, Qualcomm Mdm9635m Firmware, Qualcomm Mdm9645 Firmware and 24 more.

How do I fix CVE-2017-18319?

No fix has been published for CVE-2017-18319 yet. Limit exposure of the affected software until one is available.

Is CVE-2017-18319 being exploited?

There is no known exploitation of CVE-2017-18319 in the wild and no public exploit code.

All Qualcomm Mdm9206 Firmware vulnerabilities

Sources

Also known as GHSA-x5q9-6v9v-q798.

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