CVE-2017-18323 Information disclosure in Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear

Medium 5.5 Published Updated

Attackers can extract cryptographic keys from debug messages in Qualcomm Snapdragon firmware, compromising device security.

Exploited in the wild
Not known
Login needed
Any signed-in user
Attackable
Local or same network only
Victim action needed
Not needed
Fix
None listed

What is CVE-2017-18323?

CVE-2017-18323 is a medium-severity vulnerability in Qualcomm Mdm9206 Firmware, published on 3 Jan 2019. It can only be exploited from the same machine or local network, with no action from the victim.

Official description

Cryptographic key material leaked in TDSCDMA RRC debug messages in snapdragon automobile, snapdragon mobile and snapdragon wear in versions MDM9206, MDM9607, MDM9615, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 430, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 712 / SD 710 / SD 670, SD 820, SD 820A, SD 835, SD 845 / SD 850, SDA660, SDX20, SXR1130.

Weakness: CWE-320

Which versions are affected by CVE-2017-18323?

It affects 35 products.

Products include Qualcomm Mdm9206 Firmware, Qualcomm Mdm9607 Firmware, Qualcomm Mdm9615 Firmware, Qualcomm Mdm9635m Firmware, Qualcomm Mdm9640 Firmware, Qualcomm Mdm9645 Firmware and 29 more.

How do I fix CVE-2017-18323?

No fix has been published for CVE-2017-18323 yet. Limit exposure of the affected software until one is available.

Is CVE-2017-18323 being exploited?

There is no known exploitation of CVE-2017-18323 in the wild and no public exploit code.

All Qualcomm Mdm9206 Firmware vulnerabilities

Sources

Also known as GHSA-v7wc-hpgj-hcp7.

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