CVE-2017-18324 Information disclosure in Snapdragon Mobile, Snapdragon Wear

Medium 5.5 Published Updated

An attacker can obtain cryptographic key material from debug messages in Qualcomm Snapdragon mobile and wear firmware.

Exploited in the wild
Not known
Login needed
Any signed-in user
Attackable
Local or same network only
Victim action needed
Not needed
Fix
None listed

What is CVE-2017-18324?

CVE-2017-18324 is a medium-severity vulnerability in Qualcomm Mdm9206 Firmware, published on 3 Jan 2019. It can only be exploited from the same machine or local network, with no action from the victim.

Official description

Cryptographic key material leaked in debug messages - GERAN in snapdragon mobile and snapdragon wear in versions MDM9206, MDM9607, MDM9615, MDM9625, MDM9635M, MDM9645, MDM9650, MDM9655, MSM8909W, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 800, SD 810, SD 820, SD 835, SD 855, SDX24, Snapdragon_High_Med_2016.

Weakness: CWE-200

Which versions are affected by CVE-2017-18324?

It affects 32 products.

Products include Qualcomm Mdm9206 Firmware, Qualcomm Mdm9607 Firmware, Qualcomm Mdm9615 Firmware, Qualcomm Mdm9625 Firmware, Qualcomm Mdm9635m Firmware, Qualcomm Mdm9645 Firmware and 26 more.

How do I fix CVE-2017-18324?

No fix has been published for CVE-2017-18324 yet. Limit exposure of the affected software until one is available.

Is CVE-2017-18324 being exploited?

There is no known exploitation of CVE-2017-18324 in the wild and no public exploit code.

All Qualcomm Mdm9206 Firmware vulnerabilities

Sources

Also known as GHSA-vgpf-vwh6-qmfx.

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