CVE-2018-11264 Memory corruption in Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear

High 7.8 Published Updated

A buffer overflow in Qualcomm Snapdragon fingerprint code allows attackers to execute arbitrary code or escalate privileges via invalid input.

Exploited in the wild
Not known
Login needed
Any signed-in user
Attackable
Local or same network only
Victim action needed
Not needed
Fix
None listed

What is CVE-2018-11264?

CVE-2018-11264 is a high-severity memory corruption vulnerability in Qualcomm Mdm9206 Firmware, published on 28 Nov 2018. It can only be exploited from the same machine or local network, with no action from the victim.

Official description

Possible buffer overflow in Ontario fingerprint code due to lack of input validation for the parameters coming into TZ from HLOS in Snapdragon Automobile, Snapdragon Mobile and Snapdragon Wear in versions MDM9206, MDM9607, MDM9650, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 430, SD 450, SD 625, SD 650/52, SD 820, SD 820A, SD 835, SDA660.

Weakness: CWE-119

Which versions are affected by CVE-2018-11264?

It affects 19 products.

Products include Qualcomm Mdm9206 Firmware, Qualcomm Mdm9607 Firmware, Qualcomm Mdm9650 Firmware, Qualcomm Msm8996au Firmware, Qualcomm Sd 205 Firmware, Qualcomm Sd 210 Firmware and 13 more.

How do I fix CVE-2018-11264?

No fix has been published for CVE-2018-11264 yet. Limit exposure of the affected software until one is available.

Upgrade to the fixed version. Memory-safe languages, compiler hardening and fuzzing prevent most new cases. More about Memory corruption.

Is CVE-2018-11264 being exploited?

There is no known exploitation of CVE-2018-11264 in the wild and no public exploit code.

All Qualcomm Mdm9206 Firmware vulnerabilities

Sources

Also known as GHSA-qp77-44wf-mg85.

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