CVE-2018-11824 Memory corruption in Snapdragon Mobile, Snapdragon Wear

High 7.8 Published Updated

A stack-based buffer overflow in Qualcomm Snapdragon firmware allows attackers to execute arbitrary code or escalate privileges on affected mobile and wearable devices.

Exploited in the wild
Not known
Login needed
Any signed-in user
Attackable
Local or same network only
Victim action needed
Not needed
Fix
None listed

What is CVE-2018-11824?

CVE-2018-11824 is a high-severity memory corruption vulnerability in Qualcomm Mdm9206 Firmware, published on 26 Oct 2018. It can only be exploited from the same machine or local network, with no action from the victim.

Official description

A stack-based buffer overflow can occur in a firmware routine in Snapdragon Mobile, Snapdragon Wear in version MDM9206, MDM9607, MDM9650, SD 210/SD 212/SD 205, SD 835, SD 845, SD 850, SDA660

Weakness: CWE-787

Which versions are affected by CVE-2018-11824?

It affects 10 products.

Products include Qualcomm Mdm9206 Firmware, Qualcomm Mdm9607 Firmware, Qualcomm Mdm9650 Firmware, Qualcomm Sd 205 Firmware, Qualcomm Sd 210 Firmware, Qualcomm Sd 212 Firmware and 4 more.

How do I fix CVE-2018-11824?

No fix has been published for CVE-2018-11824 yet. Limit exposure of the affected software until one is available.

Upgrade to the fixed version. Memory-safe languages, compiler hardening and fuzzing prevent most new cases. More about Memory corruption.

Is CVE-2018-11824 being exploited?

There is no known exploitation of CVE-2018-11824 in the wild and no public exploit code.

All Qualcomm Mdm9206 Firmware vulnerabilities

Sources

Also known as GHSA-3h3m-3crc-mmh6.

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