CVE-2018-5874 Memory corruption in Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear

High 8.8 Published Updated

A stack-based buffer overflow in Qualcomm Snapdragon firmware allows attackers to execute arbitrary code via a malicious MP4 file.

Exploited in the wild
Not known
Login needed
Not needed
Attackable
Over the internet
Victim action needed
A user has to click or open something
Fix
None listed

What is CVE-2018-5874?

CVE-2018-5874 is a high-severity memory corruption vulnerability in Qualcomm Mdm9206 Firmware, published on 6 Jul 2018. An attacker can exploit it over the internet without logging in, and only if a user opens a file or follows a link.

Official description

While parsing an mp4 file, a stack-based buffer overflow can occur in Snapdragon Automobile, Snapdragon Mobile and Snapdragon Wear.

Weakness: CWE-787

Which versions are affected by CVE-2018-5874?

It affects 24 products.

Products include Qualcomm Mdm9206 Firmware, Qualcomm Mdm9607 Firmware, Qualcomm Mdm9650 Firmware, Qualcomm Msm8909w Firmware, Qualcomm Msm8996au Firmware, Qualcomm Sd 205 Firmware and 18 more.

How do I fix CVE-2018-5874?

No fix has been published for CVE-2018-5874 yet. Limit exposure of the affected software until one is available.

Upgrade to the fixed version. Memory-safe languages, compiler hardening and fuzzing prevent most new cases. More about Memory corruption.

Is CVE-2018-5874 being exploited?

There is no known exploitation of CVE-2018-5874 in the wild and no public exploit code.

All Qualcomm Mdm9206 Firmware vulnerabilities

Sources

Also known as GHSA-6pvm-c9p6-3qj6.

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