CVE-2018-5881 Memory corruption in Snapdragon Mobile, Snapdragon Wear

High 8.8 Published Updated

Buffer overflow in Qualcomm Snapdragon firmware allows attackers to execute arbitrary code or escalate privileges via the LwM2M protocol.

Exploited in the wild
Not known
Login needed
Not needed
Attackable
Local or same network only
Victim action needed
Not needed
Fix
None listed

What is CVE-2018-5881?

CVE-2018-5881 is a high-severity memory corruption vulnerability in Qualcomm Mdm9206 Firmware, published on 18 Jan 2019. It can only be exploited from the same machine or local network, with no action from the victim.

Official description

Improper validation of buffer length checks in the lwm2m device management protocol can leads to a buffer overflow in snapdragon mobile and snapdragon wear in versions MDM9206, MDM9607, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 450, SD 625, SD 636, SD 835, SDA660, SDM630, SDM660

Weakness: CWE-119

Which versions are affected by CVE-2018-5881?

It affects 16 products.

Products include Qualcomm Mdm9206 Firmware, Qualcomm Mdm9607 Firmware, Qualcomm Sd 205 Firmware, Qualcomm Sd 210 Firmware, Qualcomm Sd 212 Firmware, Qualcomm Sd 425 Firmware and 10 more.

How do I fix CVE-2018-5881?

No fix has been published for CVE-2018-5881 yet. Limit exposure of the affected software until one is available.

Upgrade to the fixed version. Memory-safe languages, compiler hardening and fuzzing prevent most new cases. More about Memory corruption.

Is CVE-2018-5881 being exploited?

There is no known exploitation of CVE-2018-5881 in the wild and no public exploit code.

All Qualcomm Mdm9206 Firmware vulnerabilities

Sources

Also known as GHSA-h665-3f9q-67w8.

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