CVE-2019-10606 Memory corruption in Snapdragon Auto, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables

High 7.8 Published 21 Jan 2020 Updated 4 Aug 2024

Out-of-bounds access in the USB driver allows attackers to execute arbitrary code or escalate privileges on affected Qualcomm Snapdragon devices.

Exploited in the wild: Not known
Login needed: Any signed-in user
Attackable: Local or same network only
Victim action needed: Not needed
Fix: None listed

What is CVE-2019-10606?

CVE-2019-10606 is a high-severity memory corruption vulnerability in Qualcomm Mdm9607 Firmware, published on 21 Jan 2020. It can only be exploited from the same machine or local network, with no action from the victim.

Official description

Out-of-bound access will occur in USB driver due to lack of check to validate the frame size passed by user in Snapdragon Auto, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables in MDM9607, MSM8909W, MSM8917, MSM8920, MSM8937, MSM8940, QCS605, SDX24

Weakness: CWE-120

Which versions are affected by CVE-2019-10606?

It affects 8 products.

Products include Qualcomm Mdm9607 Firmware, Qualcomm Msm8909w Firmware, Qualcomm Msm8917 Firmware, Qualcomm Msm8920 Firmware, Qualcomm Msm8937 Firmware, Qualcomm Msm8940 Firmware and 2 more.

How do I fix CVE-2019-10606?

No fix has been published for CVE-2019-10606 yet. Limit exposure of the affected software until one is available.

Upgrade to the fixed version. Memory-safe languages, compiler hardening and fuzzing prevent most new cases. More about Memory corruption.

Is CVE-2019-10606 being exploited?

There is no known exploitation of CVE-2019-10606 in the wild and no public exploit code.

All Qualcomm Mdm9607 Firmware vulnerabilities

Sources

Also known as GHSA-vp3x-6rvm-hm6v.