CVE-2019-17517 Memory corruption in n/a
Attackers in radio range can cause a buffer overflow via crafted Link Layer packets in the Dialog Semiconductor BLE SDK, potentially leading to code execution or denial of service.
- Exploited in the wild
- Not known
- Login needed
- Not needed
- Attackable
- Local or same network only
- Victim action needed
- A user has to click or open something
- Fix
- None listed
What is CVE-2019-17517?
CVE-2019-17517 is a medium-severity memory corruption vulnerability in n/a, published on 10 Feb 2020. It can only be exploited from the same machine or local network, and only if a user opens a file or follows a link.
Official description
The Bluetooth Low Energy implementation on Dialog Semiconductor SDK through 5.0.4 for DA14580/1/2/3 devices does not properly restrict the L2CAP payload length, allowing attackers in radio range to cause a buffer overflow via a crafted Link Layer packet.
Weakness: CWE-120
Which versions are affected by CVE-2019-17517?
It affects 1 product.
Products include Dialog-Semiconductor Software Development Kit.
How do I fix CVE-2019-17517?
No fix has been published for CVE-2019-17517 yet. Limit exposure of the affected software until one is available.
Upgrade to the fixed version. Memory-safe languages, compiler hardening and fuzzing prevent most new cases. More about Memory corruption.
Is CVE-2019-17517 being exploited?
There is no known exploitation of CVE-2019-17517 in the wild and no public exploit code.
Other vulnerabilities in n/a
Sources
Also known as GHSA-w3vp-q725-9fj8.