CVE-2019-19196 Memory corruption in n/a
An attacker in radio range can cause a denial of service via crafted Bluetooth pairing packets due to a buffer overflow in the Telink BLE SDK.
- Exploited in the wild
- Not known
- Login needed
- Not needed
- Attackable
- Local or same network only
- Victim action needed
- Not needed
- Fix
- None listed
What is CVE-2019-19196?
CVE-2019-19196 is a medium-severity memory corruption vulnerability in n/a, published on 12 Feb 2020. It can only be exploited from the same machine or local network, with no action from the victim.
Official description
The Bluetooth Low Energy Secure Manager Protocol (SMP) implementation on Telink Semiconductor BLE SDK versions before November 2019 for TLSR8x5x through 3.4.0, TLSR823x through 1.3.0, and TLSR826x through 3.3 devices accepts a pairing request with a key size greater than 16 bytes, allowing an attacker in radio range to cause a buffer overflow and denial of service (crash) via crafted packets.
Weakness: CWE-120
Which versions are affected by CVE-2019-19196?
It affects 5 products.
Products include Telink-Semi Tlsr8232 Ble Sdk, Telink-Semi Tlsr8251 Ble Sdk, Telink-Semi Tlsr8253 Ble Sdk, Telink-Semi Tlsr8258 Ble Sdk, Telink-Semi Tlsr8269 Ble Sdk.
How do I fix CVE-2019-19196?
No fix has been published for CVE-2019-19196 yet. Limit exposure of the affected software until one is available.
Upgrade to the fixed version. Memory-safe languages, compiler hardening and fuzzing prevent most new cases. More about Memory corruption.
Is CVE-2019-19196 being exploited?
There is no known exploitation of CVE-2019-19196 in the wild and no public exploit code.
Other vulnerabilities in n/a
Sources
Also known as GHSA-2v47-vh6m-54xv.