{"answers":{"affected":"It affects 1 product.","exploited":"There is no known exploitation of CVE-2022-25333 in the wild and no public exploit code.","fix":"No fix has been published for CVE-2022-25333 yet. Limit exposure of the affected software until one is available.","what":"CVE-2022-25333 is a high-severity vulnerability in Texas Instruments OMAP, published on 19 Oct 2023. It can only be exploited from the same machine or local network, with no action from the victim."},"fix_prompt":"Check this codebase for CVE-2022-25333 and fix it if it is affected.\n\nWhat it is: CVE-2022-25333 is a high-severity vulnerability in Texas Instruments OMAP, published on 19 Oct 2023. It can only be exploited from the same machine or local network, with no action from the victim.\nExploitation: There is no known exploitation of CVE-2022-25333 in the wild and no public exploit code.\n\nAffected product: Texas Instruments OMAP. No package-level version data is available, so check the vendor advisory linked from the reference page.\n\nTask:\n1. Search the dependency manifests and lockfiles (for example package.json, package-lock.json, requirements.txt, poetry.lock, uv.lock, pom.xml, build.gradle, go.mod, Cargo.lock, Gemfile.lock) and any Dockerfiles for the affected packages, including transitive dependencies.\n2. If an affected version is in use, upgrade it to the fixed version for its release line with the project's package manager, so the lockfile is regenerated. Prefer the smallest upgrade that fixes it.\n3. If there is no fix, or the upgrade would break the build, do not guess: explain the risk and the safest workaround instead.\n4. Run the tests and summarise what changed and why.\n5. If nothing in the project is affected, say so and change nothing.\n\nReference: https://insights.sbomify.com/CVE-2022-25333/ (Markdown: https://insights.sbomify.com/CVE-2022-25333/index.md)","id":"CVE-2022-25333","markdown":"https://insights.sbomify.com/CVE-2022-25333/index.md","name":"CVE-2022-25333","record":{"aliases":["GHSA-f4x5-257x-2739"],"analysis":{"component_type":"hardware_firmware","fix_type":"no_fix_stated","impacts":["code_execution","privilege_escalation"],"network_reachable":"adjacent_or_local","non_default_config":false,"product_category":"TI OMAP L138 TEE","requires_auth":"high_privilege","summary":"Attackers can bypass TEE security by reusing signed headers with forged payloads to execute arbitrary code in the secure context of TI OMAP L138 devices.","user_interaction":"not_required","vuln_class":"security_feature_bypass"},"analysis_generated_by":"qwen3.8-flash-next","assigner":"NCSC-NL","cpe":[{"product":"omap_l138_firmware","vendor":"ti"}],"cvss":{"score":8.2,"severity":"high","source":"cna","vector":"CVSS:3.1/AV:L/AC:L/PR:H/UI:N/S:C/C:H/I:H/A:H/E:F/RL:U/RC:C/CR:H/IR:H/AR:H/MAV:L/MAC:L/MPR:H/MUI:N/MS:C/MC:H/MI:H/MA:H","version":"3.1"},"cwes":[{"id":"CWE-347","name":"Improper Verification of Cryptographic Signature"}],"description":"The Texas Instruments OMAP L138 (secure variants) trusted execution environment (TEE) performs an RSA check implemented in mask ROM when loading a module through the SK_LOAD routine. However, only the module header authenticity is validated. An adversary can re-use any correctly signed header and append a forged payload, to be encrypted using the CEK (obtainable through CVE-2022-25332) in order to obtain arbitrary code execution in secure context. This constitutes a full break of the TEE security architecture.","ecosystems":[],"exploits":{"exploitdb":0,"first_seen":null,"github_poc":0,"max_poc_stars":null,"metasploit":0,"nuclei":0,"refs":[],"tier":"none_known"},"has_fix":null,"headline":"Flawed SK_LOAD module authenticity check in Texas Instruments OMAP L138","id":"CVE-2022-25333","indexable":true,"kev":null,"kind":"cve","links":{"ecosystem":null,"product":null,"products":[],"type":"security_feature_bypass","year":"2022"},"n_packages":0,"n_references":1,"next":{"headline":"Stack overflow on SK_LOAD signature length field in Texas Instruments OMAP L138","id":"CVE-2022-25334"},"packages":[],"prev":{"headline":"SK_LOAD timing side channel during AES module decryption in Texas Instruments OMAP L138","id":"CVE-2022-25332"},"products":["OMAP"],"published":"2023-10-19","related":[{"cvss_score":8.2,"headline":"Stack overflow on SK_LOAD signature length field in Texas Instruments OMAP L138","id":"CVE-2022-25334","kev_date_added":null,"published":"2023-10-19"},{"cvss_score":4.4,"headline":"SK_LOAD timing side channel during AES module decryption in Texas Instruments OMAP L138","id":"CVE-2022-25332","kev_date_added":null,"published":"2023-10-19"}],"sources":[{"class":"attribution","licence":"CVE Terms of Use (MITRE)","name":"CVE List","prefix":"CVE"},{"class":"attribution","licence":"US public information, NVD API terms","name":"NVD"},{"class":"attribution","licence":"CWE Terms of Use","name":"CWE (MITRE)"},{"class":"attribution","licence":"FIRST CVSS licence","name":"CVSS (FIRST)"}],"ssvc":{"automatable":null,"exploitation":null,"technical_impact":null},"state":"PUBLISHED","updated":"2024-08-03","vendors":["Texas Instruments"]},"summary":"Attackers can bypass TEE security by reusing signed headers with forged payloads to execute arbitrary code in the secure context of TI OMAP L138 devices.","url":"https://insights.sbomify.com/CVE-2022-25333/"}