CVE-2022-49860 dmaengine: ti: k3-udma-glue: fix memory leak when register device fail
A memory leak in the TI k3-udma-glue driver allows attackers to cause denial of service by triggering device registration failures.
- Exploited in the wild
- Not known
- Login needed
- Any signed-in user
- Attackable
- Local or same network only
- Victim action needed
- Not needed
- Fix
- Available
What is CVE-2022-49860?
CVE-2022-49860 is a medium-severity denial of service vulnerability in Linux kernel, published on 1 May 2025. It can only be exploited from the same machine or local network, with no action from the victim.
Official description
In the Linux kernel, the following vulnerability has been resolved:
dmaengine: ti: k3-udma-glue: fix memory leak when register device fail
If device_register() fails, it should call put_device() to give up reference, the name allocated in dev_set_name() can be freed in callback function kobject_cleanup().
Weakness: CWE-401
Which versions are affected by CVE-2022-49860?
It affects 1 product.
Products include Linux kernel.
How do I fix CVE-2022-49860?
Apply the vendor's patch.
Upgrade, then put limits on request size, rate and nesting depth so one client cannot exhaust the service. More about Denial of service.
Is CVE-2022-49860 being exploited?
There is no known exploitation of CVE-2022-49860 in the wild and no public exploit code.
Other vulnerabilities in Linux kernel
Sources
Also known as DEBIAN-CVE-2022-49860, GHSA-hpf7-wq23-7pvr, UBUNTU-CVE-2022-49860.