CVE-2023-21624 Information Exposure in DSP Services
An attacker can expose sensitive information during dynamic module loading in Qualcomm DSP services, affecting Snapdragon devices.
- Exploited in the wild
- Not known
- Login needed
- Not needed
- Attackable
- Local or same network only
- Victim action needed
- Not needed
- Fix
- None listed
What is CVE-2023-21624?
CVE-2023-21624 is a medium-severity vulnerability in Qualcomm Fastconnect 6700 Firmware, published on 4 Jul 2023. It can only be exploited from the same machine or local network, with no action from the victim.
Official description
Information disclosure in DSP Services while loading dynamic module.
Weakness: CWE-200
Which versions are affected by CVE-2023-21624?
It affects 67 products.
Products include Qualcomm Fastconnect 6700 Firmware, Qualcomm Fastconnect 6800 Firmware, Qualcomm Fastconnect 6900 Firmware, Qualcomm Qam8255p Firmware, Qualcomm Qca6310 Firmware, Qualcomm Qca6320 Firmware and 61 more.
How do I fix CVE-2023-21624?
No fix has been published for CVE-2023-21624 yet. Limit exposure of the affected software until one is available.
Is CVE-2023-21624 being exploited?
There is no known exploitation of CVE-2023-21624 in the wild and no public exploit code.
Other vulnerabilities in Qualcomm Fastconnect 6700 Firmware
- CVE-2024-43047 Qualcomm Multiple Chipsets Use-After-Free
- CVE-2023-21671 Improper Input Validation in Core
- CVE-2024-21464 Buffer Copy Without Checking Size of Input in Data Network Stack & Connectivity
- CVE-2024-33047 Buffer Over-read in Display
- CVE-2024-23360 Improper Access Control in Graphics Windows
Sources
Also known as GHSA-vwvg-9fjq-r84q.