CVE-2023-22670 Memory corruption in n/a

High 7.8 Published 15 Apr 2023 Updated 5 May 2025

Heap-based buffer overflow in Open Design Alliance Drawings SDK allows remote code execution via malicious DXF files.

Exploited in the wild: Not known
Login needed: Not needed
Attackable: Local or same network only
Victim action needed: A user has to click or open something
Fix: None listed

What is CVE-2023-22670?

CVE-2023-22670 is a high-severity memory corruption vulnerability in n/a, published on 15 Apr 2023. It can only be exploited from the same machine or local network, and only if a user opens a file or follows a link.

Official description

A heap-based buffer overflow exists in the DXF file reading procedure in Open Design Alliance Drawings SDK before 2023.6. The specific flaw exists within the parsing of DXF files. The issue results from the lack of proper validation of the length of user-supplied XRecord data prior to copying it to a fixed-length heap-based buffer. An attacker can leverage this vulnerability to execute code in the context of the current process.

Weakness: CWE-787

Which versions are affected by CVE-2023-22670?

It affects 1 product.

Products include Opendesign Drawings Sdk.

How do I fix CVE-2023-22670?

No fix has been published for CVE-2023-22670 yet. Limit exposure of the affected software until one is available.

Upgrade to the fixed version. Memory-safe languages, compiler hardening and fuzzing prevent most new cases. More about Memory corruption.

Is CVE-2023-22670 being exploited?

There is no known exploitation of CVE-2023-22670 in the wild and no public exploit code.

Sources

Also known as GHSA-v2g6-r34c-4x3h.