CVE-2023-33017 Buffer Copy Without Checking Size of Input in Boot

High 7.8 Published Updated

A buffer overflow in Qualcomm Snapdragon Boot allows attackers to execute arbitrary code or escalate privileges during the UEFI boot process.

Exploited in the wild
Not known
Login needed
Any signed-in user
Attackable
Local or same network only
Victim action needed
Not needed
Fix
None listed

What is CVE-2023-33017?

CVE-2023-33017 is a high-severity memory corruption vulnerability in Qualcomm 315 5g Iot Modem Firmware, published on 5 Dec 2023. It can only be exploited from the same machine or local network, with no action from the victim.

Official description

Memory corruption in Boot while running a ListVars test in UEFI Menu during boot.

Weakness: CWE-120

Which versions are affected by CVE-2023-33017?

It affects 277 products.

Products include Qualcomm 315 5g Iot Modem Firmware, Qualcomm 9205 Lte Modem Firmware, Qualcomm 9206 Lte Modem Firmware, Qualcomm 9207 Lte Modem Firmware, Qualcomm Apq5053-Aa Firmware, Qualcomm Apq8009 Firmware and 271 more.

How do I fix CVE-2023-33017?

No fix has been published for CVE-2023-33017 yet. Limit exposure of the affected software until one is available.

Upgrade to the fixed version. Memory-safe languages, compiler hardening and fuzzing prevent most new cases. More about Memory corruption.

Is CVE-2023-33017 being exploited?

There is no known exploitation of CVE-2023-33017 in the wild and no public exploit code.

All Qualcomm 315 5g Iot Modem Firmware vulnerabilities

Sources

Also known as GHSA-xmc3-8wf5-r59w.

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