CVE-2023-33049 Improper Release of Memory Before Removing Last Reference in Multi-Mode Call Processor
A heap leak in the Multi-Mode Call Processor allows attackers to cause a transient denial of service on Qualcomm Snapdragon devices.
- Exploited in the wild
- Not known
- Login needed
- Not needed
- Attackable
- Over the internet
- Victim action needed
- Not needed
- Fix
- None listed
What is CVE-2023-33049?
CVE-2023-33049 is a high-severity memory corruption vulnerability in Qualcomm 315 5g Iot Modem Firmware, published on 6 Feb 2024. An attacker can exploit it over the internet without logging in, with no action from the victim.
Official description
Transient DOS in Multi-Mode Call Processor due to UE failure because of heap leakage.
Weakness: CWE-401
Which versions are affected by CVE-2023-33049?
It affects 101 products.
Products include Qualcomm 315 5g Iot Modem Firmware, Qualcomm Ar8035 Firmware, Qualcomm Fastconnect 6200 Firmware, Qualcomm Fastconnect 6700 Firmware, Qualcomm Fastconnect 6800 Firmware, Qualcomm Fastconnect 6900 Firmware and 95 more.
How do I fix CVE-2023-33049?
No fix has been published for CVE-2023-33049 yet. Limit exposure of the affected software until one is available.
Upgrade to the fixed version. Memory-safe languages, compiler hardening and fuzzing prevent most new cases. More about Memory corruption.
Is CVE-2023-33049 being exploited?
There is no known exploitation of CVE-2023-33049 in the wild and no public exploit code.
Other vulnerabilities in Qualcomm 315 5g Iot Modem Firmware
- CVE-2023-33107 Qualcomm Multiple Chipsets Integer Overflow
- CVE-2023-33063 Qualcomm Multiple Chipsets Use-After-Free
- CVE-2025-27034 Improper Validation of Array Index in Multi-Mode Call Processor
- CVE-2023-22388 Use of Out-of-range Pointer Offset in Multi-mode Call Processor
- CVE-2023-28578 Improper Input Validation in Services
Sources
Also known as GHSA-33fg-vcj3-g326.