CVE-2024-23374 Stack-based Buffer Overflow in Power Management IC
A stack-based buffer overflow in Qualcomm Snapdragon Power Management IC allows local attackers to execute arbitrary code or escalate privileges via haptics debugfs.
- Exploited in the wild
- Not known
- Login needed
- An administrator
- Attackable
- Local or same network only
- Victim action needed
- Not needed
- Fix
- None listed
What is CVE-2024-23374?
CVE-2024-23374 is a medium-severity memory corruption vulnerability in Qualcomm Fastconnect 6900 Firmware, published on 7 Oct 2024. It can only be exploited from the same machine or local network, with no action from the victim.
Official description
Memory corruption is possible when an attempt is made from userspace or console to write some haptics effects pattern to the haptics debugfs file.
Which versions are affected by CVE-2024-23374?
It affects 26 products.
Products include Qualcomm Fastconnect 6900 Firmware, Qualcomm Fastconnect 7800 Firmware, Qualcomm Qca6174a Firmware, Qualcomm Qca6574au Firmware, Qualcomm Qca6584au Firmware, Qualcomm Qca6696 Firmware and 20 more.
How do I fix CVE-2024-23374?
No fix has been published for CVE-2024-23374 yet. Limit exposure of the affected software until one is available.
Upgrade to the fixed version. Memory-safe languages, compiler hardening and fuzzing prevent most new cases. More about Memory corruption.
Is CVE-2024-23374 being exploited?
There is no known exploitation of CVE-2024-23374 in the wild and no public exploit code.
Other vulnerabilities in Qualcomm Fastconnect 6900 Firmware
Sources
Also known as GHSA-923r-gp72-rmm4.