CVE-2026-21372 Heap-Based Buffer Overflow in Power Management IC

High 7.8 Published 6 Apr 2026 Updated 7 Apr 2026

Heap-based buffer overflow in Qualcomm Snapdragon Power Management IC allows attackers to execute arbitrary code or escalate privileges via malicious IOCTL requests.

Exploited in the wild: Not known
Login needed: Any signed-in user
Attackable: Local or same network only
Victim action needed: Not needed
Fix: None listed

What is CVE-2026-21372?

CVE-2026-21372 is a high-severity memory corruption vulnerability in Qualcomm Cologne Firmware, published on 6 Apr 2026. It can only be exploited from the same machine or local network, with no action from the victim.

Official description

Memory Corruption when sending IOCTL requests with invalid buffer sizes during memcpy operations.

Weakness: CWE-122

Which versions are affected by CVE-2026-21372?

It affects 28 products.

Products include Qualcomm Cologne Firmware, Qualcomm Fastconnect 6700 Firmware, Qualcomm Fastconnect 6900 Firmware, Qualcomm Fastconnect 7800 Firmware, Qualcomm Qcm5430 Firmware, Qualcomm Qcm6490 Firmware and 22 more.

How do I fix CVE-2026-21372?

No fix has been published for CVE-2026-21372 yet. Limit exposure of the affected software until one is available.

Upgrade to the fixed version. Memory-safe languages, compiler hardening and fuzzing prevent most new cases. More about Memory corruption.

Is CVE-2026-21372 being exploited?

There is no known exploitation of CVE-2026-21372 in the wild and no public exploit code.

All Qualcomm Cologne Firmware vulnerabilities

Sources

Also known as GHSA-73jc-v74h-5w6r.