Qualcomm Snapdragon 670 Mobile Platform Firmware vulnerabilities
80 published vulnerabilities in Qualcomm Snapdragon 670 Mobile Platform Firmware, 1 of them exploited in the wild. The most were published in 2023 (41), and 11 so far in 2025.
Qualcomm Snapdragon 670 Mobile Platform Firmware vulnerabilities by year
2023
2024
2025
Most exploited Qualcomm Snapdragon 670 Mobile Platform Firmware vulnerabilities
- CVE-2023-33107 Qualcomm Multiple Chipsets Integer Overflow
- CVE-2025-21483 Improper Restriction of Operations within the Bounds of a Memory Buffer in Data Network Stack & Connectivity
- CVE-2023-22388 Use of Out-of-range Pointer Offset in Multi-mode Call Processor
- CVE-2023-33072 Buffer copy without checking size of Input in Core
- CVE-2023-33030 Buffer Copy without Checking Size of Input in HLOS
- CVE-2023-21673 Improper Access Control in Kernel
- CVE-2024-33044 Improper Validation of Array Index in Hypervisor
- CVE-2024-33056 Buffer Over-read in MProc
- CVE-2024-21481 Improper Restriction of Operations within the Bounds of a Memory Buffer in Hypervisor
- CVE-2024-33027 Improper Access Control in Graphics Linux
- CVE-2024-21461 Double Free in HLOS
- CVE-2024-23373 Use After Free in Graphics
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